CVE-2020-3639 : Exploit Details and Defense Strategies

Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, and Snapdragon Wearables by Qualcomm, Inc. are affected by a vulnerability that could lead to memory overflow when processing non-standard SIP sigcomp messages.

Understanding CVE-2020-3639

This CVE identifies an issue in Qualcomm products that could result in memory overflow due to the processing of specific network messages.

What is CVE-2020-3639?

When devices receive non-standard SIP sigcomp messages, there is a risk of increased UDVM cycle usage or memory overflow in various Qualcomm Snapdragon products.

The Impact of CVE-2020-3639

The vulnerability could potentially be exploited to cause memory overflow, leading to system instability or crashes in affected Qualcomm devices.

Technical Details of CVE-2020-3639

Qualcomm products are susceptible to memory overflow due to improper validation of array index in modem data processing.

Vulnerability Description

The vulnerability arises when processing non-standard SIP sigcomp messages, potentially causing increased UDVM cycle usage or memory overflow.

Affected Systems and Versions

Products: Snapdragon Auto, Compute, Consumer IOT, Industrial IOT, Mobile, Wearables
Versions: APQ8009, APQ8017, APQ8037, and many more

Exploitation Mechanism

The issue occurs when non-standard SIP sigcomp messages are received, leading to potential memory overflow.

Mitigation and Prevention

Immediate Steps to Take:

Apply patches provided by Qualcomm
Monitor for any unusual system behavior
Implement network-level protections Long-Term Security Practices:
Regularly update firmware and software
Conduct security assessments and audits
Educate users on safe network practices

Patching and Updates

Qualcomm has released patches to address the vulnerability. Ensure all affected devices are updated with the latest firmware and software versions.