Learn about CVE-2019-14030 affecting Qualcomm Snapdragon devices. Understand the buffer overflow risk and how to mitigate this security vulnerability.
Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking devices by Qualcomm lack bound check, leading to buffer overflow.
Understanding CVE-2019-14030
This CVE highlights a vulnerability in various Qualcomm products that could result in buffer overflow due to unchecked buffer sizes.
What is CVE-2019-14030?
The vulnerability in Qualcomm products allows for buffer overflow due to the lack of bound check, potentially leading to the overflow of addition and multiplication operations.
The Impact of CVE-2019-14030
The vulnerability could be exploited to manipulate buffer sizes, potentially leading to unauthorized access, data corruption, or system crashes.
Technical Details of CVE-2019-14030
Qualcomm devices are affected by a buffer overflow vulnerability due to the lack of bound check.
Vulnerability Description
The issue arises from the overflow of addition and multiplication operations, determining the size of a buffer without proper validation.
Affected Systems and Versions
Exploitation Mechanism
The lack of bound check allows attackers to manipulate buffer sizes, potentially leading to buffer overflow.
Mitigation and Prevention
Steps to address and prevent the CVE-2019-14030 vulnerability:
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates