Learn about CVE-2017-18156, a use after free vulnerability in Qualcomm Snapdragon chipsets affecting Snapdragon Automobile, Mobile, and Wear devices. Find mitigation steps and prevention measures.
A use after free vulnerability has been identified in Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear devices, potentially affecting various Qualcomm chipsets.
Understanding CVE-2017-18156
This CVE involves a specific use after free scenario in Qualcomm chipsets when processing camera buffers within the camera driver.
What is CVE-2017-18156?
A use after free vulnerability occurs in Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear devices running specific Qualcomm chipsets during camera buffer processing.
The Impact of CVE-2017-18156
This vulnerability could allow attackers to execute arbitrary code or cause a denial of service by exploiting the camera driver's buffer processing.
Technical Details of CVE-2017-18156
This section provides more technical insights into the vulnerability.
Vulnerability Description
The use after free vulnerability arises in Qualcomm chipsets MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 625, SD 820, SD 820A, SD 835, and SDX20 during camera buffer processing.
Affected Systems and Versions
Exploitation Mechanism
The vulnerability is exploited by manipulating camera buffers within the camera driver, potentially leading to unauthorized code execution or service disruption.
Mitigation and Prevention
Protecting systems from CVE-2017-18156 requires immediate actions and long-term security measures.
Immediate Steps to Take
Long-Term Security Practices
Patching and Updates